大连旭昇电子有限公司

RFMi 晶体，性能可靠，体积小，用途广泛。

常用于无线通信设备，特别适合超微型移动封装的需求。

表面贴装密封包装

优良的可靠性

性能良好的频率摄动和稳定性

超小型包装

Features: 

 Surface Mount Hermetic Package 

 Excellent Reliability Performance 

 Good Frequency Perturbation and Stability over temperature 

 Ultra Miniature Package 

 Moisture Sensitivity Level (MSL) : Level-1 

Description and Applications: 

Surface mount 2.5mmx2.0mm crystal unit for use in wireless communications devices, especially for a need of ultra miniature package for mobility.